Universal power supply for a functional cranial implant

ABSTRACT

A low-profile intercranial device with universal power supply includes a static cranial implant adapted for the selective integration of a functional neurological implant. It also includes a universal power supply having a universal implantable power source with a connector.

CROSS REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.16/590,930, entitled “UNIVERSAL POWER SUPPLY FOR A FUNCTIONAL CRANIALIMPLANT,” filed Oct. 2, 2019, which claims the benefit of U.S. PatentApplication Publication No. 62/740,106, entitled “UNIVERSAL POWER SUPPLYFOR A FUNCTIONAL CRANIAL IMPLANT,” filed Oct. 2, 2018, both of which areincorporated herein by reference.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present invention relates to a universal power supply for afunctional cranial implant.

2. Description of the Related Art

Fabricating a power supply for a functional cranial implant can be ascomplicated as actually designing the implant itself or the functionalneurological implant mounted therein. With this in mind, the presentinvention provides a universal power supply specifically adapted for usein conjunction with a wide variety of functional cranial implants.

SUMMARY OF THE INVENTION

In an embodiment, a low-profile intercranial device with universal powersupply includes a static cranial implant and a universal power supply.The universal power supply includes a universal implantable power sourcewith a connector adapted for connection to a functional neurosurgicalimplant.

In another embodiment, a system for remote powering of a functionalneurosurgical implant includes a static cranial implant housing a powersupply and a functional neurosurgical implant. The power supply includesan implantable power source and a wireless charging system. Thefunctional neurosurgical implant is in communication with the wirelesscharging system for powering the functional neurosurgical implant.

Other advantages of the present invention will become apparent from thefollowing detailed description when viewed in conjunction with theaccompanying drawings, which set forth certain embodiments of theinvention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a low-profile intercranial device with auniversal power supply.

FIG. 2 is an exploded view of the low-profile intercranial device with auniversal power supply as shown in FIG. 1.

FIG. 2A is an exploded view of the low-profile intercranial device witha universal power supply in accordance with an alternate embodiment.

FIG. 3 is a cross sectional view of the low-profile intercranial devicewith a universal power supply along the line 3-3 in FIG. 1 and installedwithin the cranium of a patient.

FIG. 4 is a perspective of the low-profile intercranial device with auniversal power supply installed within the cranium of a patient.

FIG. 5 is an exploded view of the low-profile intercranial device with auniversal power supply in accordance with another embodiment.

FIGS. 6A and 6B are schematics of embodiments of the universal powersupply that may be used in conjunction with the embodiment shown in FIG.5.

FIG. 7 is a perspective view of an embodiment of the low-profileintercranial device with a universal power supply.

FIG. 8 is a perspective view of another embodiment of the low-profileintercranial device with a universal power supply.

FIG. 9 is a schematic showing use of the low-profile intercranial devicewith a universal power supply.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

The detailed embodiments of the present invention are disclosed herein.It should be understood, however, that the disclosed embodiments aremerely exemplary of the invention, which may be embodied in variousforms. Therefore, the details disclosed herein are not to be interpretedas limiting, but merely as a basis for teaching one skilled in the arthow to make and/or use the invention.

With reference to the various embodiments disclosed below with referenceto FIGS. 1 to 9, a low-profile intercranial device with a universalpower supply is disclosed. In accordance with one embodiment disclosedwith reference to FIGS. 1 to 5, 6A and 6B, the low-profile intercranialdevice 10, 10′ with a universal power supply 12, 12′ includes a staticcranial implant 14 adapted for the selective integration of a functionalneurological implant 16, 16′ therein. In accordance with anotherembodiment disclosed with reference to FIG. 7 the low-profileintercranial device 110 includes a universal power supply 112 housedwithin a static cranial implant 114 of an intercranial assembly 111,while the functional neurological implant 116 is housed within amounting plate 150 of the intercranial assembly 111. In accordance withyet another embodiment as disclosed with reference to FIGS. 8 and 9, thelow-profile intercranial device 210 with a universal power supply 212includes a static cranial implant 214 adapted for interaction with afunctional neurological implant 216, 216′ which is located external tothe static cranial implant 214 which contains the universal power supply212; that is, the static intercranial implant 212 contains only theuniversal power supply 212 and is electrically connected to a functionalneurological device 216, 216′ which is part of a separate and distinctintercranial device 214′ or is directly implanted into the body (e.g., amicrochip implanted directly within the skull).

As is explained below in greater detail, the universal power supply ofthe present invention is adapted for using in conjunction with a widearray of functional neurological devices. In accordance with oneembodiment, this is achieved by providing a power source with a poweroutput profile standardized for use in conjunction with a wide array offunctional neurological devices through interconnection via industrystandard wired connections or industry standard wireless power transferprotocols (for example, via inductive coupling or capacitive coupling).

As used within this disclosure, the term “intercranial” means situatedor occurring within the cranium itself such that such devices arepositioned within the space existing between the inner surface of thescalp and the outer surface of the dura. As such, intercranial devicesare those devices intended for positioning within the cranium itself asopposed to devices that may be positioned on or adjacent to the craniumor positioned along the interior of the cranium, for example, betweenthe cerebral cortex and the interior surface of the cranium. With thisin mind, intercranial devices such as those discussed below replaceresected portions of the cranium due to abnormalities in the cranium,damage to the cranium, or other medically sufficient reasons forresecting portions of the cranium.

As those skilled in the art will appreciate, it is often desirable that“intercranial” implants have the exact thickness and width, and/or shapeand contour to replace all bone missing, as a method to avoid threesuboptimal sequelae including 1) prevent dead space underneath (if theimplant was thinner than missing bone), 2) causing inadvertent anddetrimental pressure on the scalp above if and when the implant wentbeyond the outer cortex limits of the missing bone (if the implant wasthicker than missing bone), and 3) causing inadvertent and detrimentalpressure on the dura/brain underneath if and when the implant wentbeyond the inner cortex limits of the missing bone (if the implant wasthicker than missing bone). Such “intercranial” implants have threepotential indications for use including either replacing bone which hasalready been removed previously (at a previous surgical date, known asdelayed cranioplasty), replacing diseased bone at time of surgicalresection (referred to as single-stage cranioplasty), or replacingnormal bone and simply being used for its inherent function anduniversal power supply. Furthermore, the term “intercranial” is opposedto devices that may be positioned on or adjacent to the cranium orpositioned along the interior of the cranium, for example, between thecerebral cortex and the interior surface of the cranium.

The term “static” is used in the description of the present inventionbecause the static cranial implant 14, has no encapsulated inner working(i.e., “functional”) parts, batteries, wires, or computers, and isessentially an improved “empty-shell” which optimizes the inter-implantpositioning within the confines of the skull and the neighboringfunctional neurosurgical implant 16.

The static cranial implant 14 of the present invention is preferably alow-profile static cranial implant 14 as described in Applicant's ownU.S. Patent Application Publication No. 2018/0055640, entitled “METHODFOR MANUFACTURING A LOW-PROFILE INTERCRANIAL DEVICE AND THE LOW-PROFILEINTERCRANIAL DEVICE MANUFACTURED THEREBY,” filed Aug. 4, 2017, and PCTPublication No. WO 2017/039762, entitled “LOW-PROFILE INTERCRANIALDEVICE,” filed May 2, 2016, which are incorporated herein by reference.The static cranial implant 14 is, therefore, designed for maximalinterdigitating of the static cranial implant 14 with a functionalneurosurgical implant 16 to be selected based upon the specific needs ofthe patient. The term “interdigitating” is meant to refer to theinterlocking of two distinct elements (that is, the static cranialimplant 14 and the functional neurosurgical implant 16) such that thetwo distinct elements mesh together to ultimately define a singleproduct. It is appreciated that while the various embodiments disclosedherein only show a single functional neurosurgical implant 16 inconjunction with a static cranial implant 14, multiple functionalneurosurgical implants 16 may be used in a single static cranial implant14 in accordance with the present invention. The static cranial implant14 is adapted for ideal functional and aesthetic benefits, therebyminimizing unnecessary spaces, inter-implant gaps, and sharp irregularangles. This helps to minimize risk of scalp pain, visible deformity,and implant micromotion—all of which often leads to treatment failureand surgical explantation (that is, premature removal of the implant).

As briefly mentioned above, the low-profile intercranial device 10 witha universal power supply 12 includes a universal power supply 12integrated with the static cranial implant 14. As will be explainedbelow in greater detail, the static cranial implant 14 is formed with apower supply recess 18 (and associated passageways) adapted for theplacement of the universal power supply 12 within the static cranialimplant 14. As with the incorporation of the functional neurologicalimplant 16 into the static cranial implant 14, the power supply recess18 is formed to provide for maximal interdigitating of the staticcranial implant 14 with the universal power supply 12.

In order to achieve ideal fit amongst the static cranial implant 14, thefunctional neurological implant 16 and the universal power supply 12,the static cranial implant 14 of the present invention employs a CT(Computed Tomography) scan-based, virtual design session performedpre-operatively based on the brain-specific geographical location (asopposed to the standard method of using the skull-specific geographiclocation) in the manufacture of the low-profile intercranial device 10.In addition, a plain X-ray or MRI (Magnetic Resonance Imaging) wouldfail to provide enough bone data for manufacturing and designing thistype of intercranial implant. As a result, and for the first time, themethodology employed in accordance with the present inventionaccommodates both brain and skull pathology in three-dimensional space,in all three axes, prior to surgery.

With this information, as well as knowledge regarding the dimensions ofthe functional neurosurgical implant 16 and universal power supply 12,the static cranial implant 14 is produced. The static cranial implant 14is augmented, reduced and/or modified to include a cavity 20 for thefunctional neurosurgical implant 16. It is appreciated multiple cavitiesmay be employed where the functional neurosurgical implant(s) 16 beingused dictates and that the cavity 20 need not be directly in the centerof the static cranial implant 14 but may be offset as dictated by theprocedure being performed. The static cranial implant 11 is alsoaugmented, reduced and/or modified to include other structural elements22 (for example, wire tunnel(s), pocket(s), etc.), shaped anddimensioned for optimal anatomical placement of the functionalneurosurgical implant 16 that is ultimately positioned within theconfines of the cavity 20 (and other structural element(s)) of thestatic cranial implant 14 (i.e., like an empty shell case but with exactnegative and positive enhancements to optimize anatomical positioning ofboth the static cranial implant 14 and the functional neurosurgicalimplant 16).

The static cranial implant 14 is also augmented, reduced and/or modifiedto include the power supply recess 18 for the universal power supply 12(it is appreciated multiple recesses may be employed where the universalpower supply(ies) 12 being used dictates), as well as other structuralelements 24 (for example, wire tunnel(s), pocket(s), etc.), shaped anddimensioned for optimal anatomical placement of the universal powersupply 12 that is ultimately positioned within the confines of the powersupply recess 18 (and other structural element(s)) of the static cranialimplant 14 (i.e., like an empty shell case but with exact negative andpositive enhancements to optimize anatomical positioning of both thestatic cranial implant 14 and the universal power supply 12).

Depending upon the specifics of the functional neurosurgical implant 16and the universal power supply 12 positioned within the cavities 18, 20of the of static cranial implant 14, various mechanical couplingmechanisms, for example, screws, plates, etc. (not shown), are used toensure that the functional neurosurgical implant 16 and the universalpower supply 12 are securely held in place. As will be explained belowin greater detail, the manufacture of the low-profile intercranialdevice 10 utilizes computer-based designs and modeling (CAD/CAM) of boththe static cranial implant 14, the functional neurosurgical implant 16,and the universal power supply 12.

The computer-based designs of the static cranial implant 14, thefunctional neurosurgical implant 16, and the universal power supply 12are optimized in the manner described in Applicant's own U.S. PatentApplication Publication No. 2018/0055640, entitled “METHOD FORMANUFACTURING A LOW-PROFILE INTERCRANIAL DEVICE AND THE LOW-PROFILEINTERCRANIAL DEVICE MANUFACTURED THEREBY,” filed Aug. 4, 2017, and PCTPublication No. WO 2017/039762, entitled “LOW-PROFILE INTERCRANIALDEVICE,” filed May 2, 2016, which are incorporated herein by reference.

Briefly, and as will be appreciated based upon the following disclosure,the static cranial implant 14 of the present invention is a modifiedversion of a low-profile cranial implant commonly used and known bythose skilled in the art of cranial surgical procedures. Such implantsmay take a variety of forms and are most commonly shaped and dimensionedfor integration into the structure of a patient's skull; that is, thestatic cranial implant 14 has a geometry that substantially conforms toa resected portion of the patient's anatomy to which the implant is tobe secured. Briefly, the static cranial implant 14 of the presentinvention includes an outer (commonly convex) first surface 14 o, aninner (commonly concave) second surface 14 i, and a peripheral edge 14 pextending between the outer first surface 14 o and the inner secondsurface 14 i. The static cranial implant 14 is shaped and dimensionedfor engagement with the skull of the patient upon implantation in amanner well known to those skilled in the field of neurosurgicalprocedures. The outer first surface 14 o and inner second surface 14 iof the static cranial implant 14 are preferably curved in a superior toinferior direction, a posterior to anterior direction, and a medial tolateral direction. In addition, the peripheral edge 14 p has asubstantial taper for resting upon a matching taper formed along theskull. It is, however, appreciated that this taper may vary (or notexist at all, that is, the peripheral edge 14 p may be substantiallyperpendicular relative to the outer first surface 14 o and the innersecond surface 14 i) depending upon the specific needs of the procedure.

In accordance with a preferred embodiment, the static cranial implant 14has a preselected thickness not exceeding the space between the innersurface of the scalp and the outer surface of the dura, for example, inthe range of around 1 millimeter to 25 millimeters (with areas ofstrategic bulking and/or thinning) and depending upon the strength ofthe materials used in the construction of the static cranial implant 14.Preferably, the static cranial implant 14 will have a thickness of 1millimeter to 12 millimeters. These lower and upper limits are ofsignificance. One millimeter is the smallest thickness for which mostalloplastic materials can remain protective of the brain related totensile strength, one example being poly-methyl-methacrylate. Twelvemillimeters is the estimated size for which one should consider abnormalimpingement of the underlying brain, for which may causepressure-related paralysis upon the motor cortex of the brain.

As mentioned above, the static cranial implant 14 also includes a cavity20 (for example, formed along the inner surface) and optional structuralelements 22, for example, channels, pockets, access holes, and/or otherstructural elements, designed to accommodate various features of thefunctional neurosurgical implant 16. In the disclosed embodiment,structural elements 22 in the form of channels are provided. Thechannels 22 have a first end 22 a in communication with the cavity 20and a second end 22 b extending to the inner second surface 14 i of thestatic cranial implant 14 for the passage of electrodes of thefunctional neurosurgical implant 16 for applying stimulation to thebrain. Since many functional neurosurgical implants 16 interact with acontrol device (not shown) via wireless mechanisms, access between theouter first surface 14 o (or top surface) and the center cavity 20 maynot be required, although it is appreciated channels or other structuralelements 22 could certainly be provided for external contact as needed.

As is also mentioned above, the static cranial implant 14 also includesa power supply recess 18 (for example, formed along the inner surface)and optional structural elements 24, for example, channels, pockets,access holes, and/or other structural elements, designed to accommodatevarious features of the universal power supply 12, and connectionsbetween the universal power supply 12 and the functional neurosurgicalimplant 16. In the disclosed embodiment, structural elements 24 in theform of channels are provided.

In accordance with a first embodiment, and as briefly discussed above,the universal power supply 12 includes a universal implantable powersource 30 with a standard (or proprietary) wired connector 32 forconnection of the power source 30 with the functional neurosurgicalimplant 16 (via wires 29 extending between the universal power supply 12and the functional neurosurgical implant 16) so as to provide powerthereto. The power source 30 has a power output profile standardized foruse in conjunction with a wide array of functional neurological devicesand includes an industry standard connector.

In accordance with an alternate embodiment as shown with reference toFIG. 2A, the universal power supply 12 may include a wirelesscommunication and/or charging system 31 (for example, a wirelesscommunication and/or charging system employing standard wireless powertransfer protocols (for example, via inductive coupling or capacitivecoupling)), alone or in conjunction with the standard connector 32discussed above. Such a wireless communication and/or charging system 31functions in conjunction with a functional neurosurgical implant 16′,which has been designed to allow for wireless electrical power transferthereto, to provide for the wireless transfer of electrical power fromthe universal power supply 12 to the functional neurosurgical implant16.

Through the provision of such a universal power supply 12, specificmedical devices that require power will have a known standard to employfor the baseline of the design. For example, if one were to develop abrain stimulator, he/she would take the present universal power supply12 into consideration as he/she designed the brain simulator. Therefore,the brain simulator would be designed to function in a “plug and play”manner with the universal power supply so as to reduce the regulatoryand engineering burden on the stimulator development.

The power source 30 may take the form of a lithium-ion battery, asolid-state battery, a microbiology battery, a glucose powered system,or a piezoelectric battery. Such batteries as are preferablyrechargeable through mechanisms known to those skilled in the art. Thepower source could also take the form of malleable solid-statebatteries. Still further, the universal power supply could beconstructed such that batteries and components making up the powersource are housed through a process in which they are suspended andfully encapsulated (for example, like a fossil in sap) or built aroundwith a top and bottom enclosure (that is, sandwiched). Such a sandwichprocess will allow later replacement of batteries, indefinitely. It isalso contemplated, the power source might take the form of a perpetualbattery run by kinetic energy (for example, like the automaticmechanical systems employed in various watches, for example, a Rolex®watch). For the purposes of disclosure, the terms “battery” or“batteries” is used below interchangeably with the term power sourcewhen describing various embodiment of the present invention. Inaccordance with such an embodiment, the power source provides an outputvoltage that can be a multiple of the nominal voltage of the cells ofthe power source. If a voltage regulation device is used as discussedbelow, the output voltage can be amplified to any value to meet thepower demands of the functional device.

As to the wired connector 32, it will take the form of a universallyaccepted form, for example, Lightning connector, USB connector, otherconnector structures well known to those skilled in the art. With 3-Dprinting, it is further appreciated the connection to the functionalneurosurgical implant could be achieved via soldering, laser welding orother mechanisms for hardwiring of the power source to the functionalneurosurgical implant.

Regardless of whether the universal power supply disclosed withreference to FIGS. 1, 2, 3 and 4 or with reference to FIGS. 2A isemployed, it is appreciated the universal power supply could includemultiple batteries as the power source 30.

In accordance with an alternate embodiment, as shown with reference toFIGS. 5, 6A, and 6B, the universal power supply 12′ is a variable powerdevice accommodating various power demands. The power supply 12′includes an output control system 33′ integrated with the implantablepower source 30′ for selectively adjusting the output of the universalpower supply 12′ to accommodate the needs of the functionalneurosurgical implant 16′. As with the prior embodiment, such auniversal power supply 12′ would include a wired connector 32 and/or awireless communication and/or charging system 31 (please note thewireless communication and/or charging system 31′ is shown in FIGS. 5,6A, and 6B, although it is appreciated wireless or wired electricalpower transfer could be used, alone or in combination, in accordancewith the present embodiment).

In accordance with a first embodiment of the universal power supply 12′adapted to accommodate various power demands, and as shown in detailwith reference to FIG. 6A, the output control system 33′ is anadjustable voltage regulator (or controller). Such voltage regulators(or controllers) are known in the art and are composed of variableresistors, diodes, transistors, operational amplifiers, switches, orcombinations of such components. The voltage regulator (or controller)33′ is used to maintain a specified input voltage to the functionalneurosurgical implant 16′, which has been designed to allow for wirelesselectrical power transfer thereto, to ensure the functionalneurosurgical implant 16′ will function properly. If the functionalneurosurgical implant 16′ were to unexpectedly draw excessive current,the voltage regulator (or controller) 33′ is provided with a safety andprotection mechanism to prevent the functional neurosurgical implant 16′from damaging itself or harming the patient.

In addition to the voltage regulator (or controller) 33′, the outputcontrol system 33′ also includes a power management system 35′integrated with the universal power supply 30′ to control the voltageregulator (or controller) 33′ and, thereby, manage the power deliveryand charging of the power source 30′, for example, implantedbattery(ies). The power management system 35′ is able to receiveinformation, either wirelessly or by direct connection, about the powerneeds of the functional neurosurgical implant 16′ in order to deliverappropriate power. For example, it is contemplated the power managementsystem 35′ could interrogate the functional neurosurgical implant 16 todetermine the power requirements thereof and subsequently adjust thepower output to accommodate the specific needs of the functionalneurosurgical implant 16′. Further, it is also contemplated the powermanagement system 35′ could interrogate the functional neurosurgicalimplant 16′ to ensure compatibility and provide a warning where, forwhatever reasons, the power source is not compatible with the functionalneurosurgical implant.

The power management system 35′ is also able to transmit information,either wirelessly or by direct connection, about the state of thebattery(ies) 30′ and supply of power to the functional neurosurgicalimplant 16′ (or to an external receiver). The power management system35′ also controls the power output and power input to and from thebattery(ies) 30′ for the purposes of providing power to the functionalneurosurgical implant 16′ or charging the battery(ies) 30′.

As discussed above, the universal power supply is contemplated toinclude an implantable power source composed of multiple batteries asthe power source. Where multiple batteries 30 b′ are used as theimplantable power source 30′, and with reference to FIG. 6B, theconfiguration of the batteries 30 b′ can be customized to achievedesired power characteristics and thereby provide an another embodimentfor the provision of a variable power device accommodating various powerdemands. By altering the batteries' configuration from series toparallel, or any combination thereof, the capacity and output voltage ofthe batteries 30 b′ can be tailored to meet the demands of thefunctional neurosurgical implant 16′. It is appreciated theconfiguration of the batteries 30 b′ can be changed wirelessly on-demandthrough the use of a power management system 35′ controlling circuitswitching components and circuits 37′, for example, through theintegration of electromechanical regulators that wirelessly open andclose circuits so as to alter the battery configuration.

As with the embodiment discussed above, and as briefly discussed above,the power management system 35′ is integrated with the implantable powersource 30′ to manage the power delivery and charging of the implantedbatteries 30 b′. The power management system 35′ is able to receiveinformation, either wirelessly or by direct connection, about the powerneeds of the functional neurosurgical implant 16′ in order to deliverappropriate power. For example, it is contemplated the power managementsystem 35′ could interrogate the functional neurosurgical implant 16 todetermine the power requirements thereof and subsequently adjust thepower output to accommodate the specific needs of the functionalneurosurgical implant 16′. Further, it is also contemplated the powermanagement system 35′ could interrogate the functional neurosurgicalimplant 16′ to ensure compatibility and provide a warning where, forwhatever reasons, the power source 30′ is not compatible with thefunctional neurosurgical implant 16′.

The power management system is also able to transmit information, eitherwirelessly or by direct connection, about the state of the batteries 30b′ and power supply to the functional neurosurgical implant 16′ or to anexternal receiver. The power management system also controls the poweroutput and power input to and from the batteries 30 b′ for the purposesof providing power to the functional neurosurgical implant 16′ orcharging the batteries.

By altering the batteries' configuration under the control of powermanagement system 35′ it is possible to selectively provide highervoltage by configuring batteries 30 b′ in series or higher current andcapacity by configuring batteries 30 b′ in parallel. Further still,through the use of multiple batteries 30 b′ it is possible to addresslong-term patient needs. For example, if a functional neurosurgicalimplant 16′ intended to be implanted for an extended length of time onlyrequires one battery to functional properly, additional back-upbatteries can remain idle within the static cranial implant 14 untiltheir needs are called upon. This allows, for example, through theintegration of electromechanical regulators that wirelessly open andclose circuits as discussed above, old, spent batteries to be wirelesslydisconnected from the circuit while the idle, fresh batteries areintegrated into the circuit without the need for surgical intervention,thus extending the lifespan of the universal power supply.

In accordance with a preferred embodiment, the cranial implant 14 isfabricated from a wide array of commonly-available biomaterialsincluding, but not limited to, clear and/or opaque PMMA (Poly(methylmethacrylate)), PEEK (Polyether ether ketone), PEKK(Polyetherketoneketone), porous polyethylene, titanium alloy, boneallograft, bone autograft, bone xenograft, and/or various othertissue-engineered bone constructs. In accordance with one embodiment,the static cranial implant 14 is ideally made of clear PMMA since it'sfully lucent and transparent. This allows for novel inspection of theinterdigitated functional neurosurgical implant 16 and neighboringcomponents. As will be explained below in greater detail, it also allowsfor the critical transmission of vital imaging with minimal distortion,such as ultrasound waves for brain pathology detection, and wirelesssignal communication (i.e., electroencephalography or ECOG)—essentialfor various neuromodulation devices such as NeuroPace®, for example—asfirst described by Gordon et al. in Operating Surgery in 2017 (fullcitation below). Another clear material that may be readily used inaccordance with the present invention is cubic zirconium While clearmaterial is disclosed in accordance with a preferred embodiment, it isappreciated the underlying concepts of the present invention may beachieved through the utilization of an opaque static cranial implant 14.

The optical clarity of the static cranial implant 14 is important inexpanding the potential uses of the low-profile intercranial device 10and in expanding the potential functional neurosurgical implants 16 thatmay be used in conjunction with the present invention. For example, theprovision of high optical clarity allows for wireless optical linksbetween the functional neurosurgical implants 16 and remote devices orbetween functional devices on the interior of the cranium and theexterior of the low-profile intercranial device 10 (for example,transmitting between the cortex and the other side of the low-profileintercranial device). Enhanced optical clarity similarly allows forpower transmission and/or receipt between the functional neurosurgicalimplants 16 and devices outside of the static cranial implant 14.Potential operations that may be achieved through the utilization ofoptical links through a high clarity static cranial implant 14 include,but are not limited to, device start-up, device calibration, and deviceoperational control.

Still further, the static cranial implant 14 is constructed of amaterial allowing for imaging of the brain through the static cranialimplant 14, for example, via ultra-sound. It is known that clear PMMAwill provide the ability to permit ultra-sound imaging of the braintherethrough so long as it is manufactured without additives that mightfunction to block the frequency and amplitude of the ultrasoundtransducer. In accordance with one embodiment, the static cranialimplant 14 is ideally made of clear PMMA since it's fully translucent tolight, sonolucent to ultrasound, radiolucent to ECOG signals (as firstdescribed by Gordon et al. in “First in-human experience with completeintegration of neuromodulation device within a customized cranialimplant.” Operative Neurosurg 2017), and transparent for idealvisualization necessary for brain lead placement, catheter positioning,etc.

In addition to the optimal material choice, the preferred static cranialimplant may be 3D printed, direct digital manufacturing, or acombination thereof. In this way necessary circuitry can be printed intoor added to the implant at the optimal location(s) during the additivemanufacturing process.

While a preferred static cranial implant 14 is disclosed in accordancewith the present invention, the static cranial implant 14 used inconjunction with the present invention may take a variety of forms solong as the static cranial implant 14 includes a cavity 20 (and,optionally, other structural elements) configured to conform to theexact requirements of the functional neurosurgical implant 16 and apower supply recess 18 (and, optionally, other structural elements)configured to confirm to the exact requirements of the universal powersupply 12 in accordance with the present invention.

Based upon the functional neurosurgical implant 16 used in conjunctionwith the present invention, the functional neurosurgical implant 16 maybe useful in the treatment of various patient conditions such as braintumor management (drug delivery, remote image monitoring), hydrocephalus(flow monitor, ICP pressure sensors), epilepsy, movement disorders,chronic pain, spasticity, cerebral palsy, multiple sclerosis, spinalcord injury (with or without paralysis), traumatic brain injury,attention-deficit/hyperactivity disorder, autism, obsessive-compulsivedisorders, etc.—and the potential to obtain supra-normal levels of brainfunction in both military and civilian situations for enhanced memory orphysical activity. Furthermore, incorporation of imaging devices withincranial implants 14 could help to provide ongoing tumor bed monitoringfor early detection of disease recurrence.

By way of example, one potential functional neurosurgical implant 16that may be employed in accordance with the present invention is abattery-powered functional neurosurgical implant 16 known as theNeuroPace® device, that is, a device for responsive neurostimulation forepilepsy, which has a design flaw in that it limits the visibleaesthetic result due to its irregular shape(s), causes undue pressure onthe undersurface of the scalp, and suffers significant implantmicromotion thereby leading to common device infection and bone flaposteomyelitis (See, Wei Z, Gordon C R, Bergey G K, Sacks J M, Anderson WS. Implant Site Infection and Bone Flap Osteomyelitis Associated withthe NeuroPace Responsive Neurostimulation System. World Neurosurg 2015Dec. 29; pii: s1878-8750(15)075-1.) These deficiencies are overcome inaccordance with the present invention by optimizing the static cranialimplant 14 for receipt of the NeuroPace® device and improving its rigidplacement within the intercranial space.

With the foregoing in mind, additional functional neurosurgical implants16 that may be used in conjunction with the present invention include,but are not limited to the following: Deep Brain Stimulators (DBS);Cortical Brain Stimulators (CBS); neurologic medicines that areotherwise prevented from diffusing through the blood-brain barrier viacommon delivery methods; battery, passively, kinetically, orotherwise-powered functional devices including neuromodulation devices,imaging devices, radiation therapy devices, and remotesensing/monitoring devices; monitoring devices for abnormal levels ofintracranial pressure (ICP) or brain activity (i.e., seizures), such asan electrical array for motor/vision cortex control,battery/passively/kinetically/or otherwise-based stimulation hardwarefor epilepsy management (grids/batteries/wires); low-profile remoteimaging devices (e.g., optical coherence tomography (OCT), duplexultrasound); delivery/sensing devices for electrical impulses;neurological and physiological systems required for deep space/sleepfunctionalities enhancing the monitoring and/or maintenance of bodilyvital signs, nutrition, cognition, etc.; convection enhanced deliverysystems effectively delivering therapeutics to substantial volumes ofbrain and brain tumor; and remote neuro-imaging devices (i.e.,electroencephalogram (EEG).

The functional neurosurgical implants 16 of the present invention mayalso incorporate high-precision and fully implantable next-generationneural interface systems taking advantage of microelectronics andphotonics along with advances in scalable neural encoding and processingalgorithms to demonstrate the transformation of high-definition sensorystimuli to and from sensory cortex areas, bridging physiological andelectronic neural activity representations.

With this in mind, the term “functional neurosurgical implant” is meantto reference any therapeutic hardware or compositions including, but notlimited to, medicines to treat any patient- specific illness, orelectronic, mechanical, imaging modality and/or electro-mechanicaldevice to remotely monitor (e.g., via Wi-Fi connectivity) or interveneany specific neurologic illness, including imaging, monitoring,electrostirnulation, radiation therapy, polarized light/laser neuronalmodulation devices. The term “functional” denotes the fact that theseimplants provide the low-profile intercranial device with the ability tofunction as more than a safe custom-shaped skull replacement byproviding various functionalities, for example, local drug delivery,monitoring (such as brain monitoring), or local electric stimulation tothe patient.

While the embodiment described above provides for a universal powersupply 14 that is connected to a functional neurosurgical implant(s) 16maintained within a unitary static cranial implant 14, an alternateembodiment is disclosed in FIG. 5 wherein the universal power supply 114and the functional neurosurgical implant(s) 116 are maintained indifferent portions of the intercranial device 110. In such anembodiment, the intercranial device 110 is a multi-part intercranialassembly as disclosed in Applicant's own U.S. patent application Ser.No. 16/203,357 (published as US2019/0209328) entitled “UNIVERSALLOW-PROFILE INTERCRANIAL ASSEMBLY,” which is incorporated herein byreference.

In accordance with this embodiment, the universal power supply 112 ishoused within the static cranial implant 114 of the intercranialassembly 110 and the functional neurosurgical implant(s) 116, which hasbeen designed to allow for wireless electrical power transfer thereto,is housed within the mounting plate 150 intercranial assembly 110.Briefly, and as is disclosed in detail the '328 publication, theintercranial assembly 110 is composed of mounting plate 150 in which thefunctional neurosurgical implant(s) 116 is housed and a static cranialimplant 114 in which the universal power supply 112 is housed. Throughuse of a static cranial implant 114 that may be selectively mounted anddismounted from the mounting plate 150, it is possible to easily replacethe universal power supply 112 with removing, altering, or otherwisechanging the properly positioned functional neurosurgical implant(s)116.

As the universal power supply 114 and the functional neurosurgicalimplant(s) 116 are separately housed, and it is ultimately desirable toallow for removal of the universal power supply 114 with disrupting thefunctional neurosurgical implant(s) 116, the universal power supply 114is adapted for wireless connection with the functional neurosurgicalimplant(s) 16 so as to provide power to the functional neurosurgicalimplant(s) 116. As such, it is preferred that the embodiment of theuniversal power supply as disclosed with reference to FIG. 2A be usedwith this embodiment, although it is appreciated a wired connectioncould also be used within the spirit of the present invention.

While the embodiments described above provides for a universal powersupply that is connected to a functional neurosurgical implant(s)maintained within the same implant or implanted assembly, it isappreciate various other implementations are possible. For example, andwith reference to FIGS. 8 and 9, it is contemplated that theintercranial device 210 composed of an intercranial implant withuniversal power supply contemplated by the present disclosure may takethe form of an static cranial implant 214 containing only the universalpower supply 212, and not the functional neurosurgical implant 216,216′. In accordance with such an embodiment, the neurosurgicalfunctional implant 216, 216′, which has been designed to allow forwireless electrical power transfer thereto, is located external to thestatic cranial implant 214 which contains the universal power supply212, such as in a separate static cranial implant 214′ or directlyimplanted into the body (see FIG. 9).

In implementing such an embodiment, either the cranial implant of theembodiment disclosed with reference to FIGS. 1 to 4 or the multiple-partintercranial assembly disclosed with reference to

FIG. 7 may be used to house the universal power supply 212. Themultiple-part intercranial assembly 210 disclosed with reference to FIG.7 is, however, shown in the disclosed embodiment as this allows forready replacement of the universal power supply 212.

Referring to FIGS. 8 and 9, the universal power supply 212 is housedwithin the static cranial implant 214 of the intercranial assembly 210.The functional neurosurgical implant(s) 216 may be housed within analternate implant 214′ (for example, a static cranial implant asdescribed in Applicant's own U.S. Patent Application Publication No.2018/0055640, entitled “METHOD FOR MANUFACTURING A LOW-PROFILEINTERCRANIAL DEVICE AND THE LOW-PROFILE INTERCRANIAL DEVICE MANUFACTUREDTHEREBY,” filed Aug. 4, 2017, and PCT Publication No. WO 2017/039762,entitled “LOW-PROFILE INTERCRANIAL DEVICE,” filed May 2, 2016, which areincorporated herein by reference. The functional neurosurgicalimplant(s) 216′ may also be directly implanted into the body.

As with the embodiments disclosed with reference to FIGS. 2A, 5, 6A, and6B, and considering the universal power supply 212 and the functionalneurosurgical implant(s) 216, 216′ are remotely positioned within thebody, the universal power supply 212 is adapted for wireless connectionwith the functional neurosurgical implant(s) 216, 216′ so as to providepower to the functional neurosurgical implant(s) 216, 216′. As such, itis preferred that the embodiment of the universal power supply asdisclosed with reference to FIGS. 2A, 5, 6A, and 6B be used with thisembodiment, although it is appreciated a wired connection could also beused within the spirit of the present invention.

Accordingly, the universal power supply 212 is contained in oneintercranial implant 214 with the functional neurological implant 216contained in a separate intercranial implant 214′, that is, anintercranial implant that does not nest with or otherwise form a part ofthe intercranial implant 214 in which the universal power supply 212 ishoused. In this manner, the universal power supply 212 may be implantedat one location and the functional neurosurgical device 216 may beimplanted at a different location, which may be alongside the universalpower supply 212 location or at a location separate from the universalpower supply 212 location. Such a configuration may provide manyadvantages. For example, by separating the power supply 212 from thefunctional neurosurgical implant 216 the surgeon is provided greaterflexibility in placing each device. It may be that the desired locationfor one or both of the universal power supply 212 and functionalneurosurgical device 216 is not conducive to designing and implanting animplant containing both devices, and by separating the two to differentlocations, more suitable locations for each may be used. The two merelyneed to communicate to deliver power from the universal power supply 212to the functional neurosurgical device 216.

Where the universal power supply and functional neurosurgical device arenot mounted within the same implant, it is contemplated that it may notbe necessary to employ a universal power supply to take advantage ofconcepts underlying the present invention. Rather a power supply may bespecifically matched to operate in conjunction with the functionalneurological device and remotely linked thereto to provide power for theoperation of the functional neurological device.

As discussed above, it is further contemplated that the functionalneurosurgical device 216′ may be directly implanted into the bodywithout being held in an intercranial implant. Thus, as microchip-baseddevices become more sophisticated and efficient, it may be possible toimplant all or most of the functional neurosurgical device directly intothe desired body tissue. By way of example, a microchip programmed totreat a disease or condition may be directly implanted into the brain,and powered by a universal power supply 212 implanted in theintercranial space as part of an intercranial device 210, with theuniversal power supply 212 communicating power (wired or wirelessly) tothe directly implanted functional neurosurgical implant 216′.

By way of further example, the functional neurosurgical implant 216 maybe a brain mapping device, with the brain mapping grid placed onto thebrain and connected to the universal power supply 212. After mapping, itis also contemplated the mapping grid might be removed, and theuniversal power supply 212 connected to another functional neurosurgicalimplant in the form of a functional neurological treatment device suchas an electrical stimulation device to provide treatment, with thetreatment device implanted directly into the brain or in a separateintercranial implant.

It is also contemplated that the universal power supply 212 could beconfigured to deliver power to more than one functional neurosurgicaldevice 216, 216′ (see FIG. 9). Under such circumstances, implanting theuniversal power supply 212 and each functional neurosurgical device 216,216′ independent of each other provides flexibility in the location ofeach and the access and replacement of one device independent of theothers.

In the foregoing embodiments it is also contemplated that theintercranial implant with universal power supply could be configured asan “off the shelf” item. That is, the implant need not be a customcranial implant configured to conform to the particular shape andcontour of the patient's skull. For example, the intercranial implantwith universal power supply may be pre-configured to occupy a definedshape and space with the universal power supply contained within theimplant. In this manner, a sterile universal power supply implant may bestocked ready for use in surgery with a functional neurosurgical deviceimplant.

While the preferred embodiments have been shown and described, it willbe understood that there is no intent to limit the invention by suchdisclosure, but rather, is intended to cover all modifications andalternate constructions falling within the spirit and scope of theinvention.

1. A low-profile intercranial device with universal power supply,comprising: a static cranial implant; a universal power supply includinga universal implantable power source with a connector adapted forconnection to a functional neurosurgical implant, wherein the universalimplantable power source is a solid-state battery.
 2. The low-profileintercranial device with universal power supply according to claim 1,wherein the static cranial implant is adapted for the selectiveintegration of a functional neurological implant.
 3. The low-profileintercranial device with universal power supply according to claim 1,wherein the static cranial implant includes no encapsulated innerworking.
 4. (canceled)
 5. The low-profile intercranial device withuniversal power supply according to claim 1, wherein the static cranialimplant includes a cavity shaped and dimensioned for the functionalneurosurgical implant.
 6. The low-profile intercranial device withuniversal power supply according to claim 1, wherein the solid-statebattery is a malleable solid-state battery. 7-8. (canceled)
 9. Thelow-profile intercranial device with universal power supply according toclaim 1, wherein the static cranial implant is fabricated from clearand/or opaque PMMA (Poly(methyl methacrylate)), PEEK (Polyether etherketone), PEKK (Polyetherketoneketone), porous polyethylene, titaniumalloy, bone allograft, bone autograft, bone xenograft, and/or variousother tissue-engineered bone constructs.
 10. The low-profileintercranial device with universal power supply according to claim 1,wherein the static cranial implant is fully lucent and transparent. 11.The low-profile intercranial device with universal power supplyaccording to claim 1, wherein the static cranial implant is fullytranslucent to light, sonolucent to ultrasound, radiolucent to ECOGsignals, and transparent for ideal visualization.
 12. The low-profileintercranial device with universal power supply according to claim 1,wherein the static cranial implant comprises part of a multiple-partintercranial assembly.
 13. The low-profile intercranial device withuniversal power supply according to claim 12, wherein the universalpower supply is connected to a functional neurosurgical implantcontained in a separate portion of the multiple-part intercranialassembly.
 14. The low-profile intercranial device with universal powersupply according to claim 1, wherein the universal power supply isconfigured to be connected to a functional neurosurgical implanted whichis implantable directly in the brain.
 15. A system for remote poweringof a functional neurosurgical implant, comprising: a static cranialimplant housing a power supply, the power supply including animplantable power source and a wireless charging system; a functionalneurosurgical implant in communication with the wireless charging systemfor powering the functional neurosurgical implant.
 16. The systemaccording to claim 15, wherein the implantable power source is alithium-ion battery, a solid-state battery, a microbiology battery, aglucose powered system, or a piezoelectric battery.
 17. The systemaccording to claim 15, wherein the static cranial implant is fullylucent and transparent.
 18. The system according to claim 17, whereinthe static cranial implant is fully translucent to light, sonolucent toultrasound, radiolucent to ECOG signals, and transparent for idealvisualization.
 19. The system according to claim 15, wherein the cranialimplant comprises part of a multiple part cranial implant.
 20. Thesystem according to claim 15, wherein the power supply is configured tobe connected to the functional neurosurgical implant which isimplantable directly in the brain.